# Сопутствующие статьи по теме Tao Law

Новостной центр HTX предлагает последние статьи и углубленный анализ по "Tao Law", охватывающие рыночные тренды, новости проектов, развитие технологий и политику регулирования в криптоиндустрии.

The Tao (τ) Law Makes EDA Go Viral

In May 2026, Huawei's semiconductor division introduced the "Tao (τ) Law" at IEEE ISCAS, shifting the industry focus from Moore's Law's geometric scaling to "time scaling." Unlike traditional approaches relying on transistor miniaturization, τ Law optimizes the time constant (τ) across device, circuit, chip, and system levels to improve information processing speed and efficiency. Huawei has already applied this principle, mass-producing 381 chips across various applications, with a target to achieve performance equivalent to 1.4nm technology by 2031. The implementation of τ Law, involving techniques like Chiplet, 3DIC, and Logic Folding, places new demands on EDA tools, highlighting gaps in current offerings. Traditional 2D or pseudo-3D EDA flows lack native support for true 3D design, cross-layer co-optimization (STCO), and coupled multi-physics analysis (thermal, power, stress), which are crucial for advanced integration. Chinese EDA companies, such as Empyrean Software, Primarius Technologies, and Xpeedic, are evolving from point-tool specialists to providing full-flow, system-level solutions. For instance, Peking University has developed a prototype "true 3D" EDA tool showing significant improvements in wirelength and timing. Empyrean Software has also launched a comprehensive 3DIC design and verification platform. The τ Law framework presents an opportunity for the domestic EDA industry to transition from achieving basic functionality to developing robust, integrated toolsets essential for next-generation chip design.

marsbit18 ч. назад

The Tao (τ) Law Makes EDA Go Viral

marsbit18 ч. назад

Huawei's "Tao Law": A Comprehensive Overview of Core Companies

Huawei's "Tau Law": Core Companies Overview On May 25, 2026, Huawei's Director and President of the Semiconductor Business Division, He Tingbo, formally introduced the "Tau (τ) Law" at ISCAS 2026, marking a significant principle guiding industry development in the global semiconductor field from China. The Tau Law shifts focus from traditional Moore's Law, which pursues geometric transistor scaling, to "time scaling"—continuously compressing signal propagation delay (time constant τ) without solely relying on extreme feature size reduction. The core implementation path is "logic folding." This technique transforms circuit layouts from two-dimensional planes to multi-layer 3D stacks, using short vertical interconnects to replace long horizontal wiring, thereby drastically reducing τ. Huawei has already designed and mass-produced 381 chips following this principle over the past six years, with plans to launch a Kirin chip utilizing logic folding in Fall 2026. By 2031, high-end chips based on the Tau Law are expected to achieve performance levels equivalent to a 1.4nm process node. This development impacts several key industry segments, with related Chinese companies poised to benefit: 1. **EDA Design Software**: Essential for circuit-level optimization. Key players include: * **Empyrean Technology** (Huada Jiutian): China's largest full-flow EDA provider. * **Primarius Technologies** (Gailun Dianzi): Specializes in device modeling and verification. * **Semitronix** (Guangliwei): Focuses on yield enhancement and test chip EDA. 2. **Chiplet & Advanced Packaging**: Logic folding's 3D stacking necessitates advanced packaging (e.g., TSV, hybrid bonding). Core participants are: * **Tongfu Microelectronics**: A leader in advanced packaging and a key partner for AMD's Chiplet products. * **JCET Group** (Changdian Keji) & **Tianshui Huatian Technology**: Major OSATs with advanced packaging capabilities. * **VeriSilicon** (Xinyuan Gufen): Provides Chiplet-based design platforms and IP. 3. **Foundry Manufacturing**: Optimization must be implemented in transistor structures and process parameters. Potential foundries for Huawei's future chips include: * **SMIC**: China's leading foundry with advanced FinFET capabilities, the most likely candidate for next-gen Kirin chips. * **Hua Hong Semiconductor** (Huahong Gongsi): A leader in specialty processes (power, embedded memory). * **Nexchip Semiconductor** (Jinghe Jicheng): Major foundry for display driver ICs and MCUs. The Tau Law represents a strategic move towards architectural innovation and design-process co-optimization, driving demand across the domestic semiconductor supply chain.

marsbit05/25 11:33

Huawei's "Tao Law": A Comprehensive Overview of Core Companies

marsbit05/25 11:33

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