# Сопутствующие статьи по теме Connectivity

Новостной центр HTX предлагает последние статьи и углубленный анализ по "Connectivity", охватывающие рыночные тренды, новости проектов, развитие технологий и политику регулирования в криптоиндустрии.

Huang Renxun and Marvell CEO Discuss on Stage: The Future of AI Competition is Not Computing Power but Connectivity, 'Use Copper Where You Can, Use Optics Only Where You Must'

Summary: At Computex 2024, NVIDIA CEO Jensen Huang joined Marvell CEO Matt Murphy on stage, highlighting the strategic partnership between their companies. The core theme was that the next decisive battleground for AI infrastructure is not compute or memory, but connectivity. As AI models evolve into vast agent-based systems, the ability to connect millions of processors efficiently is becoming the critical bottleneck. Huang announced NVIDIA's strategic $20 billion investment in Marvell, reflecting the deep integration between their technologies for AI data centers. A key discussion point was the transition from copper to optical interconnects within racks. The guiding principle, articulated by Huang, is: "You use optics wherever you must, you use copper wherever you can." While copper remains cost-effective for short distances, its physical limits are being reached as bandwidth demands double. When moving to 400Gbps, copper can no longer fully connect an entire rack. This shift necessitates innovations like Co-Packaged Optics (CPO), which integrates optical engines directly into the chip package to solve density and power challenges. Marvell demonstrated its 51.2T CPO-based switch, eliminating copper traces on the PCB. The future vision is a "distance-free data center," where optical connectivity removes physical constraints. This allows for fully disaggregated, dynamic architectures where compute, memory, and storage pools can be combined on-demand based on workload requirements, rather than being limited by connection boundaries. Marvell, positioned as a neutral "Switzerland" in the ecosystem with a comprehensive portfolio across all connectivity distances, is central to enabling this next era of AI infrastructure.

marsbitВчера 09:41

Huang Renxun and Marvell CEO Discuss on Stage: The Future of AI Competition is Not Computing Power but Connectivity, 'Use Copper Where You Can, Use Optics Only Where You Must'

marsbitВчера 09:41

Bernstein's 97-Page Report Decoded: The Battle for AI Data Center Connectivity, Who Will Be the True Winner by 2026?

Bernstein's 97-page report analyzes the AI data center connectivity landscape. It argues that the bottleneck is shifting from raw compute (GPU) to the systems connecting GPUs, crucial for cluster efficiency. Copper and optical interconnects are not in a simple replacement cycle but will coexist long-term, with copper dominating short-distance "scale-up" connections and optics favored for longer "scale-out" scenarios. While Co-Packaged Optics (CPO) is the long-term direction for power and cost savings, its widespread adoption faces manufacturing and reliability hurdles, with mass deployment unlikely before 2028. Transitional technologies like Linear Pluggable Optics (LPO) and Near-Packaged Optics (NPO) are seen as near-term leaders. A key insight is that CPO will fundamentally reshape the value chain, shifting profits from traditional optical module suppliers towards chip designers (e.g., NVIDIA, Broadcom), advanced packaging (e.g., TSMC), and system integrators. For 2026, the report highlights more immediate and certain investment opportunities in the essential "infrastructure" enabling this connectivity shift. This includes upgrades for PCBs, ABF substrates, and CCLa driven by new AI server/switch platforms, alongside demand for 1.6T optical modules, LPO/NPO, and the testing/validation equipment required for future CPO scale-up.

marsbit05/19 03:16

Bernstein's 97-Page Report Decoded: The Battle for AI Data Center Connectivity, Who Will Be the True Winner by 2026?

marsbit05/19 03:16

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