# Capacity İlgili Makaleler

HTX Haber Merkezi, kripto endüstrisindeki piyasa trendleri, proje güncellemeleri, teknoloji gelişmeleri ve düzenleyici politikaları kapsayan "Capacity" hakkında en son makaleleri ve derinlemesine analizleri sunmaktadır.

Report Analysis: TSMC's AI Revenue to Double by 2027, CoWoS Capacity Remains a Bottleneck

Morgan Stanley's report on June 23 forecasts explosive growth for TSMC's AI-related revenue. It predicts revenue will surge to $86.3 billion in 2027, a 218% increase from 2026's $27.1 billion. While GPUs (led by Nvidia) remain the primary driver, significant new demand is emerging from AMD's Venice CPUs and MI400 GPUs, and Google's TPUs. A critical bottleneck is CoWoS advanced packaging capacity. Global demand for CoWoS is projected to reach 2.694 million units in 2027, a 93% year-on-year increase. Even with TSMC's planned expansion to 200k wafers/month and non-TSMC capacity, a shortage is expected, particularly for high-end CoWoS-L used by Nvidia. This scarcity grants TSMC pricing power. Key near-term catalysts include improved ABF substrate supply, rising CPU demand, and Nvidia's Rubin Ultra production. The report highlights winners across the supply chain, including MediaTek (Google TPU partner) and ASE Group.

marsbit06/25 03:56

Report Analysis: TSMC's AI Revenue to Double by 2027, CoWoS Capacity Remains a Bottleneck

marsbit06/25 03:56

Super Spiral Mega-Boom, Micron's Earnings Report Rekindles the Semiconductor Bull Run

On June 25, 2026, Micron Technology released its blockbuster Q3 FY2026 results, significantly exceeding market expectations and reigniting confidence in the semiconductor bull market. Revenue soared to $41.456 billion (vs. ~$35.4B expected), up 346% year-over-year, while GAAP net profit surged nearly 15 times to $28.243 billion. Guidance for Q4 was even more striking, with projected revenue of approximately $50 billion, far surpassing prior estimates. The report highlighted that the AI boom is now fueling growth across Micron's entire product stack, not just HBM. Cloud memory, core data center, SSD, mobile, and automotive businesses all saw revenue growth exceeding 250-600%, with margins hovering around 80%. While HBM4 is already in volume shipment and 2026 capacity is sold out, AI-driven demand is also tightening supply for traditional DRAM and NAND, sustaining a strong pricing cycle. A pivotal development is Micron's shift toward a "demand-first" model. The company disclosed 16 long-term strategic customer agreements (SCAs), most spanning 5 years to 2030, covering about 20% of DRAM and one-third of NAND shipments. These are take-or-pay contracts, with 14 agreements already securing roughly $100 billion in guaranteed future revenue and $22 billion in customer performance assurances. To fulfill this locked-in demand, Micron plans substantial capacity expansion, with Q4 capital expenditure projected at ~$10 billion. This investment, backed by concrete long-term orders rather than cyclical speculation, marks a historic change for the memory industry. Following the earnings release, Micron's stock surged 16% after-hours, lifting the broader semiconductor sector globally. The report served as a powerful signal that AI infrastructure build-out is accelerating, with memory positioned as a central protagonist in the ongoing narrative.

Odaily星球日报06/25 02:43

Super Spiral Mega-Boom, Micron's Earnings Report Rekindles the Semiconductor Bull Run

Odaily星球日报06/25 02:43

DeepSeek Paralyzed for 12 Hours: Is the Computing Power of Domestic Large Models Failing to Keep Up with Ambitions?

On the evening of March 29, DeepSeek, a leading Chinese large language model, experienced a 12-hour service outage affecting both its web and app platforms. The disruption, marked by repeated server failures and instability, raised significant concerns about the platform's reliability. Initial explanations pointed to overwhelming user traffic, but data did not support a sudden surge in users. Instead, the incident highlighted deeper structural challenges, particularly in computational supply struggling to keep pace with growing AI demands. As models become more complex—supporting longer context, advanced reasoning, and multimodal tasks—the computational load increases substantially. The outage also underscored emerging usage patterns like “lobster farming,” where automated, high-frequency API calls amplify server load. Meanwhile, anticipation for DeepSeek’s upcoming V4 model—featuring major upgrades like million-token context and stronger multimodal capabilities—suggests even greater future computational pressure. This incident signals a shift in the AI industry: competition is no longer just about model capability but also infrastructure stability, cost efficiency, and engineering scalability. The outage serves as an early warning of the systemic challenges facing AI platforms as adoption expands.

marsbit04/03 12:23

DeepSeek Paralyzed for 12 Hours: Is the Computing Power of Domestic Large Models Failing to Keep Up with Ambitions?

marsbit04/03 12:23

$25 Billion: Tesla Buys the Lowest-Tier Entry Ticket to the Chip Arms Race

Elon Musk has announced Tesla's plan to invest approximately $25 billion to build a semiconductor superfab named "Terafab," targeting 2nm process technology with a production capacity of 100,000 wafers per month. The move aims to address Tesla's soaring demand for AI chips, driven by its autonomous driving systems, Optimus robots, and upcoming Robotaxi fleet, which existing foundries like TSMC and Samsung cannot fully support. However, the $25 billion budget is considered insufficient by industry standards. For comparison, TSMC’s Arizona fab costs $165 billion, Samsung’s Taylor fab $44 billion, and Intel’s Ohio project $28 billion. A standard 2nm fab with 50,000 wafers/month typically requires around $28 billion, meaning Tesla’s goal is highly ambitious. Tesla’s chip development has been rapid: from HW3 (14nm, 144 TOPS) to AI5 (3/2nm, 2000+ TOPS), with performance multiplying every generation. Its growing reliance on external foundries led to a $16.5 billion long-term deal with Samsung for AI6 production. Terafab represents a natural shift toward self-sufficiency. The project faces significant challenges, including a 3–5 year construction period and additional time for production ramp-up. If Tesla follows industry timelines, Terafab may not be operational until 2029–2030, coinciding with expected mass production of Optimus and Robotaxi. Musk has also hinted at potential collaboration with Intel, which has advanced 18A process capacity. The $25 billion investment buys Tesla a entry ticket into semiconductor manufacturing—but whether it becomes a milestone in vertical integration or an overambitious project remains to be seen.

marsbit03/16 11:06

$25 Billion: Tesla Buys the Lowest-Tier Entry Ticket to the Chip Arms Race