Report Analysis: TSMC's AI Revenue to Double by 2027, CoWoS Capacity Remains a Bottleneck
Morgan Stanley's report on June 23 forecasts explosive growth for TSMC's AI-related revenue. It predicts revenue will surge to $86.3 billion in 2027, a 218% increase from 2026's $27.1 billion. While GPUs (led by Nvidia) remain the primary driver, significant new demand is emerging from AMD's Venice CPUs and MI400 GPUs, and Google's TPUs. A critical bottleneck is CoWoS advanced packaging capacity. Global demand for CoWoS is projected to reach 2.694 million units in 2027, a 93% year-on-year increase. Even with TSMC's planned expansion to 200k wafers/month and non-TSMC capacity, a shortage is expected, particularly for high-end CoWoS-L used by Nvidia. This scarcity grants TSMC pricing power. Key near-term catalysts include improved ABF substrate supply, rising CPU demand, and Nvidia's Rubin Ultra production. The report highlights winners across the supply chain, including MediaTek (Google TPU partner) and ASE Group.
marsbit06/25 03:56
