# Packaging İlgili Makaleler

Morgan Stanley 2026 Semiconductor Report: Buy Packaging, Buy Testing, Buy China Chips, Avoid Traditional Tracks

Morgan Stanley 2026 Semiconductor Report: Buy Packaging, Buy Testing, Buy Chinese Chips; Avoid Traditional Segments. The core theme is the shift in AI compute supply from NVIDIA dominance to a three-track system of GPU + ASIC + China-local chips. The key opportunity is capturing share in this expansion, while non-AI semiconductors face marginalization due to resource reallocation to AI. Key investment conclusions, in order of priority: 1. **Advanced Packaging (CoWoS/SoIC) - Highest Conviction**: TSMC is the primary beneficiary of explosive demand, driven by massive cloud capex. Its pricing power and AI revenue share are rising significantly. 2. **Test Equipment - Undervalued & High-Growth Certainty**: Chip complexity is causing test times to double generationally, structurally driving handler/socket/probe card demand. Companies like Hon Hai Precision (Foxconn), WinWay, and MPI offer compelling value. 3. **China AI Chips (GPU/ASIC) - Long-Term Irreversible Trend**: Export controls are accelerating domestic substitution. Companies like Cambricon, with firm customer orders and SMIC's 7nm capacity support, are positioned to benefit from lower TCO (30-60% vs NVIDIA) and growing local cloud demand. 4. **Avoid Non-AI Semiconductors (Consumer/Auto/Industrial)**: These segments face a weak, structurally hindered recovery due to AI's resource "crowding-out" effect on capacity and supply chains. 5. **Memory - Severe Internal Divergence**: Strongly favor HBM (Hynix primary beneficiary) and NOR Flash (Macronix). Be cautious on interpreting price rises in DDR4/NAND as true demand recovery. The report emphasizes a 2026-2027 time window, stating the AI capital expenditure cycle is far from over. Key macro variables include persistent export controls and AI's systemic "crowding-out" effect on traditional semiconductor supply chains.

marsbit05/12 01:30