# Chiplet Related Articles

HTX News Center provides the latest articles and in-depth analysis on "Chiplet", covering market trends, project updates, tech developments, and regulatory policies in the crypto industry.

After Marvell's 32% Surge, the Chinese Chip Family Behind It Emerges

The stock price of Marvell Technology surged 32.5% on June 2nd, driven by NVIDIA CEO Jensen Huang highlighting its custom ASICs and optical interconnects as core to AI data center architecture. This event brought attention to the Chinese semiconductor family behind Marvell: the Dai siblings. The story centers on three siblings, all UC Berkeley graduates, whose three-decade entrepreneurial journey aligns with major semiconductor industry shifts. In 1995, youngest sister Dai Wei Li co-founded Marvell with her husband Sehat Sutardja and his brother, focusing on storage controllers. Eldest brother Dai Wei Min founded EDA company Ultima, later sold to Cadence, and later founded VeriSilicon (芯原) in China, becoming a leading semiconductor IP provider. Second brother Dai Wei Jin co-founded EDA firm Silicon Perspective (sold to Cadence) and GPU IP company Vivante, later acquired by VeriSilicon. The combined "Dai-Sutardja" family network extends beyond Marvell. Their ventures and investments form a comprehensive ecosystem for the post-Moore's Law, chiplet era. Key holdings include: Dream Big Semiconductor (AI SuperNICs, acquired by Arm), Alphawave (high-speed SerDes IP, acquired by Qualcomm), and Silicon Box (a chiplet advanced packaging foundry). VeriSilicon itself thrives on the AI ASIC and IP boom in China. Collectively, the family's AI infrastructure-related portfolio is estimated at over $22 billion. Their strategy represents a distinct path: building critical components for open standards and key manufacturing capacity in the chiplet era, rather than pursuing standalone AI chip dominance. While this path may not create the next NVIDIA, it has enabled repeated successful exits and sustained influence within the global semiconductor industry.

marsbit2 days ago 11:16

After Marvell's 32% Surge, the Chinese Chip Family Behind It Emerges

marsbit2 days ago 11:16

Huawei's "Tao Law": A Comprehensive Overview of Core Companies

Huawei's "Tau Law": Core Companies Overview On May 25, 2026, Huawei's Director and President of the Semiconductor Business Division, He Tingbo, formally introduced the "Tau (τ) Law" at ISCAS 2026, marking a significant principle guiding industry development in the global semiconductor field from China. The Tau Law shifts focus from traditional Moore's Law, which pursues geometric transistor scaling, to "time scaling"—continuously compressing signal propagation delay (time constant τ) without solely relying on extreme feature size reduction. The core implementation path is "logic folding." This technique transforms circuit layouts from two-dimensional planes to multi-layer 3D stacks, using short vertical interconnects to replace long horizontal wiring, thereby drastically reducing τ. Huawei has already designed and mass-produced 381 chips following this principle over the past six years, with plans to launch a Kirin chip utilizing logic folding in Fall 2026. By 2031, high-end chips based on the Tau Law are expected to achieve performance levels equivalent to a 1.4nm process node. This development impacts several key industry segments, with related Chinese companies poised to benefit: 1. **EDA Design Software**: Essential for circuit-level optimization. Key players include: * **Empyrean Technology** (Huada Jiutian): China's largest full-flow EDA provider. * **Primarius Technologies** (Gailun Dianzi): Specializes in device modeling and verification. * **Semitronix** (Guangliwei): Focuses on yield enhancement and test chip EDA. 2. **Chiplet & Advanced Packaging**: Logic folding's 3D stacking necessitates advanced packaging (e.g., TSV, hybrid bonding). Core participants are: * **Tongfu Microelectronics**: A leader in advanced packaging and a key partner for AMD's Chiplet products. * **JCET Group** (Changdian Keji) & **Tianshui Huatian Technology**: Major OSATs with advanced packaging capabilities. * **VeriSilicon** (Xinyuan Gufen): Provides Chiplet-based design platforms and IP. 3. **Foundry Manufacturing**: Optimization must be implemented in transistor structures and process parameters. Potential foundries for Huawei's future chips include: * **SMIC**: China's leading foundry with advanced FinFET capabilities, the most likely candidate for next-gen Kirin chips. * **Hua Hong Semiconductor** (Huahong Gongsi): A leader in specialty processes (power, embedded memory). * **Nexchip Semiconductor** (Jinghe Jicheng): Major foundry for display driver ICs and MCUs. The Tau Law represents a strategic move towards architectural innovation and design-process co-optimization, driving demand across the domestic semiconductor supply chain.

marsbit05/25 11:33

Huawei's "Tao Law": A Comprehensive Overview of Core Companies

marsbit05/25 11:33

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