Samsung Electro-Mechanics Begins Mass Production of FC-BGA Packaging Substrates for Qualcomm, Expand

On June 22, Samsung Electro-Mechanics commenced mass production of packaging substrate products for Qualcomm's first data center AI accelerator at its Busan factory. This supply marks an extension of its collaboration with Qualcomm from traditional mobile devices and PCs into the data center market. Recently, Samsung Electro-Mechanics has initiated mass production of FC-BGA (Flip Chip Ball Grid Array) packaging substrates for Qualcomm's latest AI accelerator, the 'AI200'. The 'AI200' is Qualcomm's first AI accelerator designed for data centers, launched in October last year, primarily targeting AI inference scenarios. This chip features Qualcomm's in-house 'Oryon' CPU and 'Hexagon' NPU, combined with low-power memory LPDDR5 to enhance energy efficiency. Qualcomm plans to launch the AI200 in the second half of this year, prompting Samsung Electro-Mechanics to enter the FC-BGA mass production phase ahead of schedule to align with the product launch timeline. This also signifies that the collaboration between the two companies in the AI chip supply chain is accelerating its extension into the data center infrastructure sector. Click the link below to join the Beating · Feishu AI news channel, which monitors global AI hotspots and news 24/7.