长推:经济衰退风险缓解,类黄金资产受到挑战

MarsBitPublicado em 2023-05-19Última atualização em 2023-05-19

Resumo

债务上限这事情还是会反反复复,核心还是最近的经济数据超预期,大家觉得衰退概率下降了。比特币还是有典型的黄金属性(0 yield),最近几周的走势也和黄金接近。衰退概率下降,有yield的股票资产相对更有吸引力,股票涨,黄金和比特币跌。又要祭出美林时钟那张图了。

对市场的看法和之前的想法一样,和之前不一样的是,美股大小盘,成长价值之间风格差别也是非常大的,现在看多纳指100(QQQ)到年中,六七月。核心的催化剂应该是 每个月公布的数据一直挺好,不衰退,前几天公布的零售和工业产出都挺好的。风险变量主要是这两周的债务上限问题。

现在市场对于债务上限能够解决乐观,周末的时候耶伦也这么说,认为两党取得了成果。拜登周末的时候也表示乐观。根据安排,两党领袖周二再次和拜登在白宫碰头。不过Kevin McCarthy周一的时候表示即使周二大家会再碰面,但是“磋商并无成效”。

这件事属于高频事件,反转来反转去的可能性都很大,但在此刻更可能是,到今天为止双方的磋商毫无进展。如果这件事有个眉目了,因为是一个budget谈判,所以会牵涉到很多具体的两党staff入场具体对接。而这些人一旦对接,那么美国的新闻媒体就马上会跟进,报道个七七八八,所有的细节和难点都会知道。

但到今天截止,除了拜登和耶伦两人在干巴巴的说乐观以外,完全看不到任何谈判细节。更奇葩的是,民主党的重量级参议员开始忽悠拜登引用不靠谱的14修正案了。债务上限突破不了行情应该跌,我认识的对美国政治比较了解的人,对债务上限这个事情偏悲观,觉得肯定不会在6月1日之前达成协议。我没这么确定。

债务上限这事情还是会反反复复,核心还是最近的经济数据超预期,大家觉得衰退概率下降了。比特币还是有典型的黄金属性(0 yield),最近几周的走势也和黄金接近。衰退概率下降,有yield的股票资产相对更有吸引力,股票涨,黄金和比特币跌。又要祭出美林时钟那张图了。

Leituras Relacionadas

Where Is the AI Infrastructure Industry Chain Stuck?

The AI infrastructure (AI Infra) industry chain is facing unprecedented systemic bottlenecks, despite the rapid emergence of applications like DeepSeek and Seedance 2.0. The surge in global computing demand has exposed critical constraints across multiple layers of the supply chain—from core manufacturing equipment and data center cabling to specialty materials and cleanroom facilities. Key challenges include four major "walls": - **Memory Wall**: High-bandwidth memory (HBM) and DRAM face structural shortages as AI inference demand outpaces training, with new capacity not expected until 2027. - **Bandwidth Wall**: Data transfer speeds lag behind computing power, causing multi-level bottlenecks in-chip, between chips, and across data centers. - **Compute Wall**: Advanced chip manufacturing, reliant on EUV lithography and monopolized by ASML, remains the fundamental constraint, with supply chain fragility affecting production. - **Power Wall**: While energy demand from data centers is rising, power supply is a solvable near-term challenge through diversified energy infrastructure. Expansion is further hindered by shortages in testing equipment, IC substrates (critical for GPUs and seeing price hikes over 30%), specialty materials like low-CTE glass fiber, and high-end cleanroom facilities. Connection technologies are evolving, with copper cables resurging for short-range links due to cost and latency advantages, while optical solutions dominate long-range scenarios. Innovations like hollow-core fiber and advanced PCB technologies (e.g., glass substrates, mSAP) are emerging to meet bandwidth needs. In summary, AI Infra bottlenecks are multidimensional, spanning compute, memory, bandwidth, power, and supply chain logistics. Advanced chip manufacturing remains the core constraint, while substrate, material, and equipment shortages present immediate challenges. The industry is moving toward hybrid copper-optical solutions and accelerated domestic supply chain development.

marsbitHá 58m

Where Is the AI Infrastructure Industry Chain Stuck?

marsbitHá 58m

Trading

Spot
Futuros
活动图片