Renowned Analyst: TSMC's Next-Generation Advanced Packaging Technology Expected to Enter Mass Production in H2 2028

06/11 03:45

On June 11, Guo Minghao, an analyst from Hong Kong's Tianfeng International Securities, stated that TSMC's next-generation advanced packaging technology, CoPoS, is expected to enter mass production in the second half of 2028. This technology is specifically designed for ultra-large packages with a photomask size exceeding 9.5 times. NVIDIA's Fermi AI chip may become the first adopter. CoPoS utilizes a glass core substrate structure, sandwiching glass between ABF build-up layers, employing specifically sized glass carriers and panels. It neither serves as a glass intermediary layer nor replaces ABF, with chips bonded to the surface of ABF, clarifying several industry misconceptions. Public information indicates that CoPoS offers a larger panel platform and space, making it highly suitable for integrating optical components of CPO (Chip-on-Photonic) such as optical engines and couplers. Future high-end AI packaging may simultaneously adopt CoPoS (large substrate) and CPO (optical I/O), forming a complete solution.

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